Additional information
| Categories |
Embedded – System On Chip (SoC) |
|---|---|
| Packaging |
Tray |
| Part Status |
Active |
| Architecture |
MCU, FPGA |
| Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size |
– |
| Ram Size |
256KB |
| Peripherals |
DMA |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed |
667MHz |
| Primary Attributes |
Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature |
-40°C ~ 100°C (TJ) |
| Package Case |
676-BBGA, FCBGA |
| Supplier Device Package |
676-FCBGA (27×27) |
| Short Description |
IC SOC CORTEX-A9 667MHZ 676FCBGA |
| Description |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 667MHz 676-FCBGA (27×27) |
| Datasheets | https://app.spb-global.com/product/SPB_ds190-Zynq-7000-Overview.pdf |
| Rohs Status |
ROHS3 Compliant |
| Lead Free Status |
Lead Free |
| Manufacturer |
Xilinx Inc. |
| Manufacturer Part Number |
XC7Z030-1FFG676I |
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