Additional information
Categories |
Sockets for ICs, Transistors |
---|---|
Features |
Open Frame |
Name |
AMP |
Packaging |
Tube |
Part Status |
Active |
Type |
DIP, 0.6" (15.24mm) Row Spacing |
Number Of Positions Or Pins Grid |
32 (2 x 16) |
Pitch Mating |
0.100" (2.54mm) |
Contact Finish Mating |
Gold |
Contact Finish Thickness Mating |
30.0µin (0.76µm) |
Contact Material Mating |
Beryllium Copper |
Mounting Type |
Through Hole |
Pitch Post |
0.100" (2.54mm) |
Termination |
Solder |
Contact Finish Post |
Gold |
Contact Finish Thickness Post |
30.0µin (0.76µm) |
Contact Material Post |
Beryllium Copper |
Housing Material |
Thermoplastic, Glass Filled |
Operating Temperature |
-55°C ~ 125°C |
Short Description |
CONN IC DIP SOCKET 32POS GOLD |
Rohs Status |
RoHS Compliant |
Lead Free Status |
Lead Free |
Manufacturer |
TE Connectivity AMP Connectors |
Manufacturer Part Number |
1-1825276-2 |
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