Additional information
Categories |
Sockets for ICs, Transistors |
---|---|
Pitch Post |
0.100" (2.54mm) |
Manufacturer Part Number |
218-3341-00-0602J |
Part Status |
Active |
Type |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
Number Of Positions Or Pins Grid |
18 (2 x 9) |
Pitch Mating |
0.100" (2.54mm) |
Contact Finish Mating |
Gold |
Contact Finish Thickness Mating |
30.0µin (0.76µm) |
Contact Material Mating |
Beryllium Copper |
Mounting Type |
Connector |
Features |
Closed Frame |
Termination |
Press-Fit |
Packaging |
Bulk |
Contact Finish Thickness Post |
30.0µin (0.76µm) |
Contact Finish Post |
Gold |
Contact Material Post |
Beryllium Copper |
Housing Material |
Polysulfone (PSU), Glass Filled |
Operating Temperature |
-55°C ~ 125°C |
Short Description |
CONN IC DIP SOCKET ZIF 18POS GLD |
Video | |
Rohs Status |
RoHS Compliant |
Lead Free Status |
Lead Free |
Manufacturer |
3M Interconnect |
Description |
The 218-3341-00 from 3M Interconnect is a high-quality electronic component with excellent performance and reliability. It features a compact design, durable construction, and efficient signal transmission capabilities, making it ideal for a variety of industrial and commercial applications. |
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